Method for forming a split-gate flash memory cell device with a low power logic device

ABSTRACT

A method of manufacturing an embedded flash memory device is provided. A pair of gate stacks are formed spaced over a semiconductor substrate, and including floating gates and control gates over the floating gates. A common gate layer is formed over the gate stacks and the semiconductor substrate, and lining sidewalls of the gate stacks. A first etch is performed into the common gate layer to recess an upper surface of the common gate layer to below upper surfaces respectively of the gate stacks, and to form an erase gate between the gate stacks. Hard masks are respectively formed over the erase gate, a word line region of the common gate layer, and a logic gate region of the common gate layer. A second etch is performed into the common gate layer with the hard masks in place to concurrently form a word line and a logic gate.

REFERENCE TO RELATED APPLICATION

This Application is a Divisional of U.S. application Ser. No.14/573,208, filed on Dec. 17, 2014, the contents of which are herebyincorporated by reference in their entirety.

BACKGROUND

A trend in the semiconductor manufacturing industry is to integratedifferent semiconductor components of a composite semiconductor deviceinto a common semiconductor structure. Such integration advantageouslyallows lower manufacturing costs, simplified manufacturing procedures,and increased operational speed. One type of composite semiconductordevice is an embedded flash memory device. An embedded flash memorydevice includes an array of flash memory cell devices and logic devicessupporting operation of the flash memory cell devices.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates a cross-sectional view of some embodiments of anembedded flash memory device with a split-gate flash memory cell deviceand a low power logic device.

FIG. 2 illustrates a flow chart of some embodiments of a method formanufacturing an embedded flash memory device having a split-gate flashmemory cell device and a low power logic device.

FIGS. 3-19 illustrates a series of cross-sectional views of someembodiments of an embedded flash memory device at intermediate stages ofmanufacture, the semiconductor structure having a split-gate flashmemory cell device and a low power logic device.

DETAILED DESCRIPTION

The present disclosure provides many different embodiments, or examples,for implementing different features of this disclosure. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Moreover, “first”, “second”, “third”, etc. may be used herein for easeof description to distinguish between different elements of a figure ora series of figures. “first”, “second”, “third”, etc. are not intendedto be descriptive of the corresponding element. Therefore, “a firstdielectric layer” described in connection with a first figure may notnecessarily corresponding to a “first dielectric layer” described inconnection with another figure.

An embedded flash memory device includes an array of flash memory celldevices and logic devices supporting operation of the flash memory celldevices. Common types of flash memory cell devices include stacked-gateflash memory cell devices and split-gate flash memory devices (e.g.,third generation SUPERFLASH (ESF3) memory cell devices). Compared tostacked-gate flash memory cell devices, split-gate flash memory celldevices have lower power consumption, higher injection efficiency, lesssusceptibility to short channel effects, and over erase immunity. Assuch, split-gate flash memory cell devices are more prevalent. Commontypes of logic devices include address decoders and read/writecircuitry.

According to some methods for manufacturing an embedded flash memorydevice, high κ metal gate (HKMG) technology is employed. Split-gateflash memory cell devices are formed with a memory region of asemiconductor substrate. Logic devices are then formed with a logicregion of the semiconductor substrate and with sacrificial gatesinsulated from the logic region by a high κ dielectric (i.e., adielectric with a dielectric constant exceeding 3.9). A first interlayerdielectric (ILD) layer is formed over the memory and logic regions, anda planarization is performed into the first ILD layer to the sacrificialgates. The sacrificial gates of the logic devices are replaced withmetal gates, and a second ILD layer is formed over the logic deviceswith contacts extending therethrough to the logic devices and the memorycell devices.

HKMG technology has become one of the front runners for the logicdevices of next generation embedded flash memory devices using 28 nm orsmaller feature sizes. Among other things, HKMG technology reducesleakage current, increases maximum drain current, mitigates the effectsof fermi-level pinning, and allows reduced threshold voltages. However,even though HKMG technology offers performance improvements, there isroom for improvement when it comes to power efficiency. In someapplications, such as mobile applications, power efficiency is moreimportant than performance.

In view of the foregoing, the present application is directed to amethod for manufacturing an embedded flash memory device with low powerlogic devices. A pair of gate stacks is formed over a memory region of asemiconductor substrate. A polysilicon layer is formed over the gatestacks, and subsequently etched back to form an erase gate between thegate stacks. A hard mask layer is formed over gate stacks and thepolysilicon layer, and subsequently etched back over the memory region.The polysilicon layer and the hard mask layers are etched to form wordlines adjacent to the gate stacks opposite the erase gate, and logicdevices over a logic region of the semiconductor substrate. An ILD layeris formed over the memory and logic regions, and contacts are formedtherethrough. Advantageously, the method is compatible with nextgeneration manufacturing processes using 28 nm or smaller feature sizesand self-aligns the word lines. Further, the method advantageouslyreduces costs compared to other methods using HKMG technology due to theuse of a shared polysilicon layer and a shared hard mask layer for theword lines, the erase gates, and the logic devices.

The present application is also directed an embedded flash memory devicewith low power logic devices. A pair of split-gate flash memory celldevices includes a memory region of a semiconductor device. Arrangedover the memory region, the pair includes gate stacks arranged onopposing sides of an erase gate, and word lines adjacent to the gatestacks opposite the erase gate. The word lines include word line ledgesexhibiting reduced heights relative to top surfaces of the word linesand opposite the erase gate. Logic devices include a logic region of thesemiconductor substrate. Arranged over the logic region, the logicdevices include logic gates insulated from the logic region by adielectric and having top surfaces about even with the word line ledges.The word lines, the erase gate, and the logic gates are formed frompolysilicon. An ILD layer is arranged over the pair and the logicdevices with contacts extending therethrough. Advantageously, theembedded flash memory device has a high power efficiency compared toHKMG embedded flash memory devices.

With reference to FIG. 1, a cross-sectional view 100 of some embodimentsof an embedded flash memory device is provided. The embedded flashmemory device includes one or more pairs 102 of split-gate flash memorycell devices 104 a, 104 b. For example, as illustrated, the embeddedflash memory device includes a pair 102 having a first split-gate flashmemory cell device 104 a and a second split-gate flash memory celldevice 104 b. The memory cell devices 104 a, 104 b of the pairs 102store data in a nonvolatile manner and are, for example, thirdgeneration SUPERFLASH (ESF3) memory cell devices.

Gate stacks 106 corresponding to the memory cell devices 104 a, 104 bare spaced over a memory region 108 of a semiconductor substrate 110.The semiconductor substrate 110 is, for example, a bulk semiconductorsubstrate or a silicon-on-insulator (SOI) substrate. A gate stack 106 ofa memory cell device 104 a, 104 b, typically of each memory cell device104 a, 104 b, includes a floating gate dielectric region 112, a floatinggate 114, a control gate dielectric region 116, a control gate 118, anda hard mask 120. The floating gate 114 is arranged over the memoryregion 108 with the floating gate dielectric region 112 interposedbetween the memory region 108 and the floating gate 114. Further, thefloating gate 114 includes a floating gate ledge 122 exhibiting areduced height relative to a top surface of the floating gate 114 andsurrounding a core region of the floating gate 114. The floating gate114 is, for example, doped polysilicon, and the floating gate dielectricregion 112 is, for example, an oxide, such as silicon dioxide. Thecontrol gate 118 is arranged over the core region with the control gatedielectric region 116 interposed between the core region and the controlgate 118. The control gate 118 is, for example, doped polysilicon, andthe control gate dielectric region 116 is, for example, anoxide-nitride-oxide (ONO) film. The hard mask 120 is arranged over thecontrol gate 118, and is, for example, silicon nitride.

Dielectric liners 124 corresponding to the gate stacks 106 extend fromthe floating gate ledges 122 of the corresponding gate stacks 106 toline the control gate dielectric regions 116, the control gates 118, andthe hard masks 120. For example, the dielectric liners 124 linesidewalls of the control gate dielectric regions 116 and the controlgates 118, and line top surfaces and sidewalls of the hard masks 120.Typically, there is a one-to-one correspondence between the gate stacks106 and the dielectric liners 124. The dielectric liners 124 are, forexample, ONO films.

First memory source/drain regions 126, erase gate dielectric regions128, and erase gates 130, corresponding to the memory cell pairs 102 arearranged between the memory cell devices 104 a, 104 b of thecorresponding memory cell pairs 102. Typically, each memory cell pair102 includes a first memory source/drain region 126, an erase gatedielectric region 128, and an erase gate 130. The erase gates 130 arearranged over the first memory source/drain regions 126 with the erasegate dielectric regions 128 interposed between the erase gates 130 andthe first memory source/drain regions 126. The erase gates 130 are, forexample, doped polysilicon, the first memory source/drain regions 126are, for example, n- or p-type doped regions of the semiconductorsubstrate 110, and the erase gate dielectric regions 128 are, forexample, oxide, such as silicon dioxide.

Word lines 132, and word line dielectric regions 134, corresponding tothe gate stacks 106 are arranged adjacent to the corresponding gatestacks 106 opposite the erase gates 130. Typically, each gate stack 106is associated with a word line 132 and a word line dielectric region134. The word lines 132 are arranged over the memory region 108 with theword line dielectric regions 134 interposed between the word lines 132and the memory region 108. Further, the word lines 132 include word lineledges 136 exhibiting reduced heights relative to top surfaces of theword lines 132 and extending along edges of the word lines 132 that areon opposite sides of the word lines 132 as the gate stacks 106. In someembodiments, the word lines 132 have a height H1 of about 800 Angstroms,and the word line ledges 136 have a height of about 700 Angstroms. Theword lines 132 are, for example, doped polysilicon, and the word linedielectric regions 134 are, for example, oxide, such as silicon dioxide.

Second memory source/drain regions 138 corresponding to the word lines132 are arranged adjacent to the corresponding word lines 132 oppositethe gate stacks 106. Typically, there is a one-to-one correspondencebetween the second memory source/drain regions 138 and the word lines132. The second memory source/drain regions 138 are, for example, n- orp-type doped regions of the semiconductor substrate 110. In someembodiments, neighboring memory cell pairs 102 share a second memorysource/drain region 138.

Dielectric spacer regions (i.e., dielectric spacers) 140, 142, 144 arearranged along sidewalls of the word lines 132, the erase gates 130, andthe gate stacks 106. First dielectric spacer regions 140 are arrangedalong sidewalls of the gate stacks 106 between the gate stacks 106 andthe erase gates 130. Second dielectric spacer regions 142 are arrangedalong sidewalls of the gate stacks 106 between the gate stacks 106 andthe word lines 132. Third dielectric spacer regions 144 are arrangedalong sidewalls of the word lines 132 on opposite sides of the wordlines 132 as the second dielectric spacer regions 142. The first andsecond dielectric spacer regions 140, 142 are, for example, oxide, suchas silicon dioxide, and the third dielectric spacer regions 144 are, forexample, silicon nitride.

In operation, a memory cell device 104 a, 104 b, typically each of thememory cell devices 104 a, 104 b, store a variable amount of charge,such as electrons, in the floating gate 114. The amount of charge storedin the floating gate 114 represents a binary value and is varied throughprogram, read, and erase operations. These operations are performedthrough selective biasing of the control gate 118, the word line 132,and the erase gate 130.

During a program operation of a memory cell device 104 a, 104 b, theword line 132 is biased and the control gate 118 is biased with a high(e.g., at least an order of magnitude higher) voltage relative tovoltages surrounding the floating gate 114 (e.g., the voltage on theword line 132). The high bias voltage promotes Fowler-Nordheim tunnelingof carriers from an underlying channel region 146 between the firstmemory source/drain region 126 and the second memory source/drain region138 towards the control gate 118. As the carriers tunnel towards thecontrol gate 118, the carriers become trapped in the floating gate 114.

During an erase operation of a memory cell device 104 a, 104 b, theerase gate 130 is biased with a high (e.g., at least an order ofmagnitude higher) voltage relative to voltages surrounding the floatinggate 114 (e.g., the voltage on the control gate 118). The high biasvoltage promotes Fowler-Nordheim tunneling of carriers from the floatinggate 114 towards the erase gate 130. As the carriers tunnel towards theerase gate 130, the carriers become dislodged or otherwise removed fromthe floating gate 114.

Charge stored in the floating gate 114 of a memory cell device 104 a,104 b screens an electric field formed between the control gate 118 andthe channel region 146 when the control gate 118 is biased. This has aneffect of increasing the threshold voltage V_(th) of the memory celldevice 104 a, 104 b by an amount ΔV_(th). Therefore, during a readoperation of a memory cell device 104 a, 104 b, the word line 132 isbiased and the control gate 118 is biased with a voltage greater thanV_(th), but less than V_(th)+ΔV_(th). If current flows through thechannel region 146, the floating gate 114 is in one state; otherwiseit's in another state.

With continued reference to FIG. 1, the embedded flash memory devicefurther includes one or more logic devices 148 a, 148 b. For example, asillustrated, the embedded flash memory device includes a first logicdevice 148 a and a second logic device 148 b. The logic devices 148 a,148 b coordinate to implement logic supporting operation of the memorycell pairs 102 and are, for example, transistors. In some embodiments,the logic devices 148 a, 148 b are arranged around the memory cell pairs102. Further, in some embodiments, as illustrated, at least some of thelogic devices 148 a, 148 b are connected in series.

Logic gates 150, and logic gate dielectric regions 152, corresponding tothe logic devices 148 a, 148 b are spaced over a logic region 154 of thesemiconductor substrate 110. Typically, each logic device 148 a, 148 bincludes a logic gate 150 and a logic gate dielectric region 152. Thelogic gates 150 are, for example, doped polysilicon, and the logic gatedielectric regions 152 are, for example, an oxide, such as silicondioxide. In some embodiments, the logic gates 150 have heights less thanthe heights of word lines 132 (e.g., 700 Angstroms versus 800 Angstroms)and/or less than half the heights of the gate stacks 106. Further, insome embodiments, the logic gates 150 have heights H2 about even withthe word line ledges 136. For example, the logic gates 150 have heightsH2 of about 700 Angstroms.

Advantageously, by forming the logic gates 150 and the logic gatedielectric regions 152 out of polysilicon and oxide, respectively, thepower efficiency of the logic devices 148 a, 148 b is improved comparedto HKMG logic devices. Further, by shrinking the logic gates 150relative to the size of the memory cell devices 104 a, 104 b and HKMGs,the power efficiency of the logic devices 148 a, 148 b is furtherimproved. For example, in some embodiments, the gate stacks 106 haveheights H2 at least about two times the heights of the logic devices148.

Logic source/drain regions 156 corresponding to the logic gates 150 arearranged adjacent to the corresponding logic gates 150. Typically, eachlogic gate 150 is associated with two logic source/drain regions 156. Alogic source/drain region 156 can be individual to the correspondinglogic gate 150 or shared by two or more logic gates 150. The logicsource/drain regions 156 correspond to n- or p-type doped regions of thelogic region 154. In operation, channel regions 158 form between thelogic source/drain regions 156 under the logic gates 150.

Fourth dielectric spacer regions 160 corresponding to the logic gates150 are arranged along sidewalls of the logics gates 150. Typically,each logic gate 150 includes a pair of fourth dielectric spacer regions160 arranged on opposing sides of the logic gate 150 between the logicsource/drain regions 156 corresponding to the logic gate 150. The fourthdielectric spacer regions 160 are, for example, oxide, such as silicondioxide.

With yet continued reference to FIG. 1, an isolation region 162 isarranged in an intermediate region 164 of the semiconductor substrate110 between the memory region 108 and the logic region 154 to isolatethe memory cell devices 104 a, 104 b from the logic devices 148 a, 148b. In some embodiments, the isolation region 162 and the intermediateregion 164 are ring-shaped and surround the memory cell devices 104 a,104 b. The isolation region 162 is, for example, a shallow trenchisolation (STI) region, a deep trench isolation (DTI) isolation, or animplant isolation region.

Silicide pads 166 are arranged over the second memory source/drainregions 138, the erase gates 130, the word lines 132, the logic gates150, and the logic source/drain regions 156. Contacts 168 extend throughan ILD layer 170, and a contact etch stop layer 172, arranged over thememory cell devices 104 a, 104 b and the logic devices 148 a, 148 b tothe silicide pads 166. The contact etch stop layer 172 is arrangedbetween the memory cell and logic devices 104 a, 104 b, 148 a, 148 b andthe ILD layer 170, and is, for example, silicon nitride. The ILD layer170 is, for example, a low κ dielectric (i.e., a dielectric with adielectric constant less than 3.9) or silicon dioxide. The contacts 168are, for example, metal, such as tungsten.

With reference to FIG. 2, a flowchart 200 provides some embodiments of amethod for manufacturing an embedded flash memory device having asplit-gate flash memory cell and a low power logic device.

At 202, a pair of gate stacks are formed spaced over a memory region ofa semiconductor substrate is formed.

At 204, a polysilicon layer, a dielectric layer, and a bottomanti-reflective coating (BARC) layer are formed, in that order, over thesemiconductor substrate and the gate stacks.

At 206, etch backs are performed into the BARC layer, the dielectriclayer, and the polysilicon layer, in that order, to form a polysiliconerase gate between the gate stacks.

At 208, the remaining BARC and dielectric layers are removed.

At 210, dopants are implanted into the remaining polysilicon layer.

At 212, hard masks are formed over the erase gate, and logic gate andword line regions of the doped polysilicon layer.

At 214, an etch is performed into regions of the doped polysilicon layerunmasked by the hard masks to form polysilicon word lines over thememory region and polysilicon logic gates over the logic region.

At 216, dopants are implanted into the semiconductor substrate to formsource/drain regions neighboring the word lies and the logic gates.

At 218, the hard masks are removed.

At 220, spacers are formed along sidewalls of the word lines and thelogic gates.

At 222, silicide pads are formed over the erase gate, the word lines,and the source/drain regions.

At 224, a contact etch stop layer and an ILD layer are formed, in thatorder, over the polysilicon silicon layer, the silicide pads, and thegate stacks.

At 226, contacts are formed through the contact etch stop layer and theILD layer to the word lines, the gate stack, the erase gate, the logicgates, and the source/drain regions.

Advantageously, the method self-aligns the word lines and is compatiblewith next generation manufacturing processes using 28 nm or smallerfeature sizes. Further, the method advantageously reduces costs relativeto other methods using HKMG technology due to the use of a sharedpolysilicon layer for the word lines, the erase gate, and the logicdevices and a simplified process.

While the disclosed methods (e.g., the method described by the flowchart200) are illustrated and described herein as a series of acts or events,it will be appreciated that the illustrated ordering of such acts orevents are not to be interpreted in a limiting sense. For example, someacts may occur in different orders and/or concurrently with other actsor events apart from those illustrated and/or described herein. Further,not all illustrated acts may be required to implement one or moreaspects or embodiments of the description herein, and one or more of theacts depicted herein may be carried out in one or more separate actsand/or phases.

With reference to FIGS. 3-19 cross-sectional and top views of someembodiments of an embedded flash memory device at various stages ofmanufacture are provided to illustrate the method of FIG. 2. AlthoughFIGS. 3-19 are described in relation to the method, it will beappreciated that the structures disclosed in FIGS. 3-19 are not limitedto the method, but instead may stand alone as structures independent ofthe method. Similarly, although the method is described in relation toFIGS. 3-19, it will be appreciated that the method is not limited to thestructures disclosed in FIGS. 3-19, but instead may stand aloneindependent of the structures disclosed in FIGS. 3-19.

FIG. 3 illustrates a cross-sectional view 300 of some embodimentscorresponding to Act 202 of FIG. 2.

As illustrated by FIG. 3, a pair of gate stacks 106 are formed orprovided spaced over a memory region 108′ of a semiconductor substrate110′. The memory region 108′ is spaced from a logic region 154′ of thesemiconductor substrate 110′ by an intermediate region 164 of thesemiconductor substrate 110′. The intermediate region 164 includes anisolation region 162 that isolates memory cell devices over the memoryregion 108′ from logic devices over the logic region 154′.

A gate stack 106 of the pair, typically of each gate stack 106 of thepair, includes a floating gate dielectric region 112, a floating gate114, a control gate dielectric region 116, a control gate 118, and ahard mask 120. The floating gate 114 is arranged over the memory region108 with the floating gate dielectric region 112 interposed between thememory region 108′ and the floating gate 114. Further, the floating gate114 includes a floating gate ledge 122 exhibiting a reduced heightrelative to a top surface of the floating gate 114 and extending arounda core region of the floating gate 114. The control gate 118 is arrangedover the core region with the control gate dielectric region 116interposed between the core region and the control gate 118. The hardmark 120 is arranged over the control gate 118, and is, for example,silicon nitride. In some embodiments, the hard mask 120 has a thicknessor height of about 1000 Angstroms.

Also illustrated by FIG. 3, dielectric liners 124 corresponding to thegate stacks 106 are formed or provided extending from the floating gateledges 122 of the gate stacks 106 to line the control gate dielectricregions 116, the control gates 118, and the hard masks 120. Further, afirst dielectric layer 302 is formed or provided to line the gate stacks106, the dielectric liners 124, and the semiconductor substrate 110′.The first dielectric layer 302 includes dielectric spacer regions 140,142 arranged along opposing sidewalls of the gate stacks 106, as well asan erase gate dielectric region 128 arranged over a first memorysource/drain region 126 between gate stacks 106. The first dielectriclayer 302 is, for example, an oxide, such as silicon dioxide.

FIG. 4 illustrates a cross-sectional view 400 of some embodimentscorresponding to Act 204 of FIG. 2.

As illustrated by FIG. 4, a polysilicon layer 402, a second dielectriclayer 404, and a BARC layer 406 are formed, in that order, over thesemiconductor substrate 110′, the first dielectric layer 302, and thegate stacks 106. The second dielectric layer 404 is, for example, anoxide, such as silicon dioxide. In some embodiments, the polysiliconlayer 402 has a thickness of about 700 Angstroms, the second dielectriclayer 404 has a thickness of about 80 Angstroms, and/or the BARC layer406 has a thickness of about 1200 Angstroms.

FIGS. 5-7 illustrate cross-sectional views 500, 600, 700 of someembodiments corresponding to Act 206 of FIG. 2.

As illustrated by FIG. 5, a first etch back is performed into the BARClayer 406 to etch the BARC layer 406 back to below the top surfaces ofthe gate stacks 106. In performing the first etch back, regions of theBARC layer 406 overlying the gate stacks 106, the erase gate dielectricregion 128, and word line regions 502 of the polysilicon layer 402 aresubstantially removed. The first etch back may be performed by exposingthe BARC layer 406 to an etchant that preferentially etches the BARClayer 406 for a predetermined period of time.

As illustrated by FIG. 6, a second etch back is performed into thesecond dielectric layer 404 to etch the second dielectric layer 404 backto below the top surfaces of the gate stacks 106 and/or to a pinnacle ofthe remaining BARC layer 406′. In performing the second etch back,regions of the second dielectric layer 40 unmasked by the BARC layer 406are substantially removed. The second etch back may be performed byexposing the second dielectric layer 404 to an etchant thatpreferentially etches the second dielectric layer 404 for apredetermined period of time.

As illustrated by FIG. 7, a third etch back is performed into thepolysilicon layer 402 to etch the polysilicon layer 402 back to belowthe top surfaces of the gate stacks 106, the top surfaces of the controlgates 118, a pinnacle of the remaining BARC layer 406′, and/or below apinnacle of the remaining second dielectric layer 404′. The third etchback is performed into regions of the polysilicon layer 402 lining thegate stacks 106 while peripheral regions are masked by the remainingBARC layer 406′ and the remaining second dielectric layer 404′. Inperforming the third etch back, a polysilicon erase gate 130′ is formedover the erase gate dielectric region 128 between the gate stacks 106.The third etch back may be performed by exposing the polysilicon layer402 to an etchant that preferentially etches the polysilicon layer 402for a predetermined period of time. In some embodiments, the word lineregions 502 are etched back to a height H1 that is about 800 Angstroms.

FIG. 8 illustrates a cross-sectional view 800 of some embodimentscorresponding to Act 208 of FIG. 2.

As illustrated by FIG. 8, the remaining second dielectric layer 404′ andthe remaining BARC layer 406′ are removed, while leaving the remainingpolysilicon layer 402′. The removal may include the sequentialapplication of etchants preferential of the remaining second dielectriclayer 404′ and the remaining BARC layer 406′.

FIG. 9 illustrates a cross-sectional view 900 of some embodimentscorresponding to Act 210 of FIG. 2.

As illustrated by FIG. 9, dopants are implanted into the remainingpolysilicon layer 402′ and the erase gate 130′. The dopants may ben-type or p-type, but are typically n-type. In some embodiments, afterimplanting the dopants, the doped polysilicon layer 402″ and the dopederase gate 130 undergo an annealing process.

FIGS. 10-12 illustrate cross-sectional views 1000, 1100, 1200 of someembodiments corresponding to Act 212 of FIG. 2.

As illustrated by FIG. 10, a hard mask layer 1002 is formed over thedoped polysilicon layer 402″ and the doped erase gate 130. In someembodiments, the hard mask layer 1002 is formed with a thickness ofabout 700 Angstroms. The hard mask layer 1002 is, for example, an oxide,such as silicon dioxide.

As illustrated by FIG. 11, a fourth etch back is performed into regionsof the hard mask layer 1002 overlying the memory and intermediateregions 108′, 164, while the logic region 154′ is masked by a firstphotoresist layer 1102. In some embodiments, the first photoresist layer1102 has a thickness of about 500 Angstroms. The fourth etch back isperformed to below a top surface of the gate stacks 106, and removesregions of the hard mask layer 1002 overlying the gate stacks 106 andbetween the word line regions 502 and the logic regions 154′. Inremoving such regions, erase gate and word line hard masks 1104, 1106are formed overlying the doped erase gate 130 and the word line regions502. The word line hard masks 1106 extend laterally passed sidewalls ofthe doped polysilicon layer 402″ opposite the gate stacks 106 andinclude sidewalls laterally spaced from the sidewalls of the dopedpolysilicon layer 402″ opposite the gate stacks 106. The fourth etchback may be performed by exposing the hard mask layer 1002 to an etchantthat preferentially etches the hard mask layer 1002 for a predeterminedperiod of time.

As illustrated by FIG. 12, a first etch is performed through regions ofthe remaining hard mask layer 1002′ unmasked by a second photoresistlayer 1202 overlying the memory region 108′ and logic gate regions 1204of the of the doped polysilicon layer 402″. In performing the firstetch, logic gate hard masks 1206 are formed from the remaining hard masklayer 1002′ over the logic gate regions 1204. In some embodiments, thefirst etch includes two sub-etches with individual masks. The processfor the first etch may include applying an unpatterned photoresistlayer, patterning the unpatterned photoresist layer to form the secondphotoresist layer 1202, applying an etchant preferential of theremaining hard mask layer 1002′, and removing the second photoresistlayer 1202.

FIG. 13 illustrates a cross-sectional view 1300 of some embodimentscorresponding to Act 214 of FIG. 2.

As illustrated by FIG. 13, the second photoresist layer 1202 is removedand a second etch is performed through regions of the of the dopedpolysilicon layer 402″ unmasked by the erase gate, word line, and logicgate hard masks 1104, 1106, 1206. In performing the second etch, wordlines 132 and logic gates 150 are formed. The word lines 132 neighborcorresponding gate stacks 106 opposite the erase gates 130, and thelogic gates 150 are spaced over the logic region 154′. Advantageously,the word lines 132 are self-aligned with the gate stacks 106. Theprocess for the second etch may include applying an etchant preferentialof the doped polysilicon layer 402″.

FIG. 14 illustrates a cross-sectional view 1400 of some embodimentscorresponding to Act 216 of FIG. 2.

As illustrated by FIG. 14, dopants are implanted into the semiconductorsubstrate 110′ to form second memory source/drain regions 138neighboring the word lines 132 and logic source/drain regionsneighboring the logic gates 150. During the implant, the erase gate,word line, and logic gate hard masks 1104, 1106, 1206 mask the wordlines 132, the erase gate 130, and the logic gates 150. Further, in someembodiments, as part of the implant process, uncovered regions of thefirst dielectric layer 302 are etched back to expose the semiconductorsubstrate 110′. The dopants may be n-type or p-type, but are typicallyn-type.

FIG. 15 illustrates a cross-sectional view 1500 of some embodimentscorresponding to Act 218 of FIG. 2.

As illustrated by FIG. 15, the erase gate, word line, and logic gatehard masks 1104, 1106, 1206 are removed. The process for removing thehard masks 1104, 1106, 1206 may include forming a photoresist layerbetween and over the hard masks 1104, 1106, 1206, etching thephotoresist layer back to below the top surfaces of the word lines 132,applying an etchant preferential of the hard masks 1104, 1106, 1206 overthe etched back photoresist layer 1502, and removing the etched backphotoresist layer 1502.

FIG. 16 illustrates a cross-sectional view 1600 of some embodimentscorresponding to Act 220 of FIG. 2.

As illustrated by FIG. 16, word line and logic gate spacers 144, 160 arerespectively formed along sidewalls of the word lines 132 and the logicgates 150. The process for forming the spacers 144, 160 may includeforming a conformal spacer layer along the word lines 132 and the logicgates 150, forming a photoresist layer between and over the word lines132 and the logic gates 150, etching the photoresist layer back to belowthe top surfaces of the word lines 132 and the logic gates 150, applyingan etchant preferential of the spacer layer over the etched backphotoresist layer, and removing the etched back photoresist layer. Thespacers 144, 160 are, for example, silicon nitride.

FIG. 17 illustrates a cross-sectional view 1700 of some embodimentscorresponding to Act 222 of FIG. 2.

As illustrated by FIG. 17, silicide pads 166 are formed over the secondmemory source/drain regions 138 and the logic source/drain regions 156,as well as over the word lines 132, the erase gate 130, and the logicgates 150. The formation of the silicide pads 166 may include: forming aconformal metal layer over the semiconductor structure; heat treatingthe semiconductor structure to invoke a reaction between the conformalmetal layer, the semiconductor substrate 110, the word lines 132, andthe logic and erase gates 130, 150; and removing the unreacted regionsof the conformal metal layer. The silicide pads 166 are, for example,nickel silicide or titanium silicide.

FIG. 18 illustrates a cross-sectional view 1800 of some embodimentscorresponding to Act 224 of FIG. 2.

As illustrated by FIG. 18, a contact etch stop layer 172′ and an ILDlayer 170′ are formed, in that order, over the silicide pads 166, thegate stacks 106, the erase gates 130, the logic gates 150, and the wordlines 132. The contact etch stop layer 172′ is, for example, siliconnitride, and the ILD layer 170′ is, for example, an oxide, such assilicon dioxide, or a low κ dielectric. In some embodiments, the processfor forming the ILD layer 170′ includes forming an intermediate ILDlayer and performing a chemical-mechanical planarization (CMP) of theintermediate ILD layer.

FIG. 19 illustrates a cross-sectional view 1900 of some embodimentscorresponding to Act 226 of FIG. 2.

As illustrated by FIG. 19, contacts 168 are formed through the contactetch stop layer 172′ and the ILD layer 170′ to one or more of the wordlines 132, the erase gate 130, the control gates 118, the logic gates150, the second memory source/drain regions 138, and the logicsource/drain regions 156. The contacts 168 are, for example, metal, suchas tungsten.

Thus, in some embodiments, the present disclosure provides a method formanufacturing an embedded flash memory device. A pair of gate stacks isformed spaced over a semiconductor substrate. The gate stacks includefloating gates and control gates arranged over the floating gates. Apolysilicon layer is formed over the gate stacks and the semiconductorsubstrate. An etch back of regions of the polysilicon layer lining thegate stacks is performed to below top surfaces of the gate stacks, whileperipheral regions of the polysilicon layer are masked, to form an erasegate between the gate stacks. Hard masks are formed over the erase gate,word line regions of the remaining polysilicon layer, and logic gateregions of the remaining polysilicon layer. An etch is performed throughregions of the remaining polysilicon layer unmasked by the hard masks toform word lines and logic gates. An ILD layer, and contacts extendingthrough the ILD layer, are formed over the gate stacks, the erase gate,the word lines, and the logic gates.

Further, in some embodiments, the present disclosure provides anothermethod for manufacturing an embedded flash memory device. A gate stackis formed over a semiconductor substrate, where the gate stack includesa floating gate and a control gate arranged over the floating gate. Acommon gate layer is formed over the gate stacks and the semiconductorsubstrate, and further lining sidewalls of the gate stacks. An erasegate is formed from the common gate layer, where the erase gate isformed adjacent to a first side of the gate stack. A word line and alogic gate are concurrently formed from the common gate layer, where theword line is formed adjacent to a second side of the gate stack,opposite the first side.

Even more, in some embodiments, the present disclosure provides yetanother method for manufacturing an embedded flash memory device. A pairof gate stacks are formed spaced over a semiconductor substrate, wherethe gate stacks include floating gates and control gates arranged overthe floating gates. A common gate layer is formed over the gate stacksand the semiconductor substrate, and further lining sidewalls of thegate stacks. A first etch is performed into the common gate layer torecess an upper surface of the common gate layer to below upper surfacesrespectively of the gate stacks, and to further form an erase gatebetween the gate stacks. Hard masks are respectively formed over theerase gate, a word line region of the common gate layer, and a logicgate region of the common gate layer. A second etch is performed intothe common gate layer with the hard masks in place to concurrently forma word line and a logic gate respectively from the word line and logicgate regions.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for manufacturing an embedded flashmemory device, the method comprising: forming a pair of gate stacksspaced over a semiconductor substrate, wherein the gate stacks includefloating gates and control gates arranged over the floating gates;forming a polysilicon layer over the gate stacks and the semiconductorsubstrate; performing an etch back of regions of the polysilicon layerlining the gate stacks to below top surfaces of the gate stacks, whileperipheral regions of the polysilicon layer are masked, to form an erasegate between the gate stacks; forming hard masks over the erase gate,word line regions of the remaining polysilicon layer, and logic gateregions of the remaining polysilicon layer; performing an etch throughregions of the remaining polysilicon layer unmasked by the hard masks toform word lines and logic gates; and forming an interlayer dielectric(ILD) layer, and contacts through the ILD layer, over the gate stacks,the erase gate, the word lines, and the logic gates.
 2. The methodaccording to claim 1, further including: forming a dielectric layer overthe polysilicon layer; forming a bottom anti-reflective coating (BARC)layer over the dielectric layer; and before performing the etch back,performing preliminary etch backs respectively of the BARC layer and thedielectric layer to below the top surfaces of the gate stacks to maskthe peripheral regions.
 3. The method according to claim 1, furtherincluding: forming the polysilicon layer conformally over the gatestacks.
 4. The method according to claim 1, further including: formingword line hard masks over the word line regions, wherein the word linehard masks are formed with widths that are greater than respective topwidths of the word line regions.
 5. The method according to claim 1,further including forming the hard masks by at least: forming a hardmask layer over the remaining poly silicon layer; performing an etchback of the hard mask layer to below the top surfaces of the gatestacks, while a logic region of the hard mask layer is masked, to formerase gate and word line hard masks; and performing an etch throughregions of the hard mask layer between the logic gate regions, while amemory region of the hard mask layer is masked, to form logic gatemasks.
 6. The method according to claim 1, further including: formingthe word lines with word line ledges exhibiting reduced heights relativeto top surfaces of the word lines; and forming the logic gates with topsurfaces approximately even with the word line ledges.
 7. The methodaccording to claim 1, further including: forming the polysilicon layerwith a thickness of approximately 700 Angstroms.
 8. The method accordingto claim 1, further including: performing the etch back to a height ofapproximately 800 Angstroms.
 9. The method according to claim 1, furtherincluding forming the gate stacks by at least: forming the floatinggates with floating gate ledges exhibiting reduced heights relative totop surfaces of the floating gates and surrounding core regions of thefloating gates; forming the control gates over the floating gates;forming hard masks over the control gates; and forming dielectric linersextending from the floating gate ledges to over top surfaces of the hardmasks.
 10. The method according to claim 9, further including formingthe dielectric liners with oxide-nitride-oxide (ONO) films.
 11. A methodfor manufacturing an embedded flash memory device, the methodcomprising: forming a gate stack over a semiconductor substrate, whereinthe gate stack includes a floating gate and a control gate arranged overthe floating gate; forming a gate layer over the gate stacks and thesemiconductor substrate, and further lining sidewalls of the gatestacks; forming an erase gate from the gate layer, wherein the erasegate is formed adjacent to a first side of the gate stack; andconcurrently forming a word line and a logic gate from the gate layer,wherein the word line is formed adjacent to a second side of the gatestack, opposite the first side.
 12. The method according to claim 11,wherein forming the erase gate comprises: performing a first etch intothe gate layer to recess an upper surface of the gate layer to below anupper surface of the gate stack.
 13. The method according to claim 12,further comprising: forming a bottom anti-reflective coating (BARC)layer over the gate layer; and before performing the first etch,performing a second etch into the BARC layer to recess an upper surfaceof the BARC layer to below the upper surface of the gate layer; whereinthe first etch is performed with the BARC layer in place to furtherrecess the upper surface of the gate layer to below the upper surface ofthe BARC layer.
 14. The method according to claim 11, wherein the gatelayer is polysilicon, and wherein the method further comprises:implanting dopants into the gate layer between forming the erase gateand forming the word line.
 15. The method according to claim 11, furthercomprising: forming a hard mask layer over the gate layer and the gatestacks; patterning the hard mask layer to cover regions of the gatelayer corresponding to the word line and the logic gate; and performinga first etch into the gate layer with the hard mask layer in place toconcurrently form the word line and the logic gate.
 16. The methodaccording to claim 15, wherein the gate stack, the erase gate, and theword line are formed over a memory cell region of the semiconductorsubstrate, and wherein the logic gate is formed over a logic region ofthe semiconductor substrate that is laterally adjacent to the memorycell region.
 17. The method according to claim 16, wherein patterningthe hard mask layer comprises: performing a second etch into the hardmask layer, while the hard mask layer is partially covered by a firstphotoresist layer masking the logic region, to recess an upper surfaceof the hard mask layer to below the upper surface of the gate stack; andperforming a third etch into the hard mask layer, while the hard masklayer is partially covered by a second photoresist layer masking thememory cell region, to pattern a region of the hard mask layer coveringthe logic region.
 18. The method according to claim 11, wherein the wordline is formed with a ledge recessed below a top surface of the wordline, and wherein the ledge is even with a top surface of the logicgate.
 19. A method for manufacturing an embedded flash memory device,the method comprising: forming a pair of gate stacks spaced over asemiconductor substrate, wherein the gate stacks include floating gatesand control gates arranged over the floating gates; forming a commongate layer over the gate stacks and the semiconductor substrate, andfurther lining sidewalls of the gate stacks; performing a first etchinto the common gate layer to recess an upper surface of the common gatelayer to below upper surfaces respectively of the gate stacks, and tofurther form an erase gate between the gate stacks; forming hard masksrespectively over the erase gate, a word line region of the common gatelayer, and a logic gate region of the common gate layer; and performinga second etch into the common gate layer with the hard masks in place toconcurrently form a word line and a logic gate respectively from theword line and logic gate regions of the common gate layer.
 20. Themethod according to claim 19, further comprising: removing the hardmasks; and forming an interlayer dielectric (ILD) layer that iscontinuous from top to bottom and that covers the gate stacks, the erasegate, the word line, and the logic gate, wherein a bottom surface of theILD layer is spaced below a top surface of the logic gate.